Characteristics in 2D Last updated on , a full moon day
2 dimensional information flows ...; Approx. 37 characteristics are available to read; Also see: IC logical functions; Materials AND circuits; Transistor;
Channel length in µm vs. Threshold voltage in dV; Characteristics = Curve;
CMOS buffer propagation delay [in ns time OR in nm distance] vs. Output stage transistor size in nm; Characteristics = Curve; Because it is a kind of Time vs. Voltage alike but the differences are Time vs. Voltage does not prompt structure of CMOS buffer; CMOS buffer propagation delay is caused by its own internal structures of capacitive loads;
Control gate voltage VCG in V vs. Transistor current ID; Characteristics = Parallel straight lines in slope; flash memory low Vt cell and high Vt cell at control gate voltage VR;
Date [14 days constraint] vs. Key generation rate;
Date [14 days constraint] vs. QBER;
Die per wafer: common characteristics are C temperature degree vs. mA, impedance ohm vs. mA, ms pulse width vs. W at peak power, millisecond pulse width vs. W at power dissipation, normalized voltage V vs. capacitance pF, V vs. forward current' milli ampere mA, voltage V vs. reverse current' mA, ... ;
Drain voltage in V vs. Drain current; Characteristics = Curve in linear region, line in slope in saturation region;
Drain voltage VDS in V vs. Drain current ID in m amp A; Characteristics = Curve in linear region, Straight line in saturation region;
Gate to Source voltage VGS in V vs. Normalized capacitance; Characteristics = Signal pattern;
Gate voltage in V vs. Drain current; Characteristics = Straight line to VT0 and then curve;
Input voltage in V vs. Output voltage V; Characteristics = Straight line to curve [cut-off point] to slope [forward active] to curve [cut-off point] to straight line; Typical; Also see: Ideal VTC in 1D;
Load capacitance in pF vs. Delay in ns; Characteristics = Line in slope; CMOS's slope > BiCMOS's slope;
Minimum-feature-size in micron in nm vs. Delay time in ns; Characteristics = Line in slope where typical gate delay and interconnect delay are indirectly propotional to each other in vector;
Monte Carlo probability density in decimal points vs. Propagation delay in ns; Characteristics = Non-consecutive dots in slope;
Negative substrate bias voltage VBB in V vs. Threshold voltage; Characteristics = Curve to represent cm-3;
nMOS Channel Width Wn in µm vs. Area x Delay Product; Characteristics = Curve to straight line in slope; where curve shows that global minima energy might exists;
nMOS Channel Width Wn in µm vs. Propagation delay in ns; Characteristics = Line in slope to curve to line in slope;
Output voltage Vout in V vs. Equivalent resistance R of CMOS; Characteristics = Curve; where Req, pMOS sine Req, nMOS is almost 1;
Power supply voltage VDD in V vs. Normalized delay in integer quantity; Vt and VDD's characteristics = Consecutive lines in slope and straight line;
Ratio t : h vs. FF, Fringing-field factor; Characteristics = Line in slope;
Ratio w : h vs. Capacitance in pF/cm; Characteristics = Line in slope;
Ratio w : h vs. FF; Characteristics = Line in slope;
Ratio w : l vs. FF; Characteristics = Line in slope;
Substrate bias in VSB voltage in V vs. Threshold voltage Vt; Characteristics = Line in slope;
Time in ms vs. Output current in mA of CMOS inverter circuit; Characteristics = Signal pattern;
Time in ms vs. Output voltage: 4V < Vout < 6.5V of CMOS inverter circuit; Characteristics = Fork signal pattern;
Time in ns vs. Amplitude V; Characteristics = Signal pattern;
Time in ns vs. Power supply current in mA; Characteristics = Pulse saw-tooth;
Time in ns vs. Power mW; Characteristics = Curve to straight line to curve to straight line to ... repeated steps upward;
Time in ns vs. Voltage V; Characteristics = Signal pattern;
Time in s [any given time] vs. Input voltage Vin; Characteristics = Signal pattern;
Time in s [any given time] vs. Output circuit current; Characteristics = Signal pattern; For basic system engineer: make you own circuit to reduce di / dt noise;
Time in s [any given time] vs. Output voltage Vout; Characteristics = Signal pattern;
Time in years vs. size in µm of integrated circuits; Characteristics = Curve;
Time in years vs. number of built-in transistors per chip; Characteristics = Straight line;
Trans-conductance Ratio kR in F vs. Switching threshold voltage; Characteristics = Curve;
Voltage V vs. Current I of SCR; Characteristics = Less than holding current IH, Curve; Higher than holding current IH, Line in slope;